Semiconductor device

ABSTRACT

A semiconductor device ( 1 ) includes a wiring ( 10 ) and dummy conductor patterns ( 20 ). The wiring ( 10 ) is a wiring through which a current with a frequency of 5 GHz or higher flows. Near the wiring ( 10 ), the dummy conductor patterns ( 20 ) are formed. A planar shape of each of the dummy conductor patterns ( 20 ) is equivalent to a shape with an internal angle larger than 180°.

BACKGROUND OF THE INVENTION

1. Field of the Invention

The present invention relates to a semiconductor device.

2. Description of the Related Art

FIG. 9 is a plan view showing a semiconductor device of a related art(for example, see JP 2005-310807 A). In a semiconductor device 100,rectangular dummy conductor patterns 102 are formed near a wiring 101.The dummy conductor patterns 102 are provided so that the wiring 101 canbe easily processed at the time of production of the semiconductordevice 100. In addition, the wiring 101 functions as an inductor.

Note that, related art documents relevant to the present inventioninclude JP 2005-285970 A and Ali Hajimiri et al., “Design Issues in CMOSDifferential LC Oscillators”, IEEE JOURNAL OF SOLID-STATE CIRCUITS, Vol.34, No. 5, May 1999, pp. 717-724, in addition to JP 2005-310807 A.

The present inventor has recognized as follows. In a case where ahigh-frequency current flows through the wiring 101 in the semiconductordevice 100 shown in FIG. 9, the following problem arises. That is, asshown in FIG. 10, by a magnetic field generated by the wiring 101, aneddy current is generated in each of the dummy conductor patterns 102positioned near the wiring 101. FIG. 10 is a plan view of an enlargedportion surrounded by the dotted line of FIG. 9. A direction of thecurrent flowing through the wiring 101 is indicated by an arrow A1 ofFIG. 10, and a direction of the eddy current flowing in the dummyconductor pattern 102 is indicated by an arrow A2 of FIG. 10.

When the eddy current is generated as described above, according toLentz's law, a magnetic field in a direction in which the magnetic fieldgenerated by the wiring 101 is offset is generated. Accordingly, acircuit constant of the wiring 101 fluctuates, which results ininstability of transmission characteristics of the wiring 101. Theproblem becomes prominent when the high-frequency current with afrequency of 5 GHz or higher flows through the wiring 101.

SUMMARY

A semiconductor device according to an aspect of the present inventionincludes: a wiring; and first dummy conductor patterns formed near thewiring, in which a planar shape of each of the first dummy conductorpatterns is equivalent to a shape with an internal angle larger than180°.

In the semiconductor device, the first dummy conductor patterns formednear the wiring each have an internal angle larger than 180° in planview. The presence of the internal angle leads to an increase incomplexity of the shape of the first dummy conductor pattern. In a casewhere a signal flowing through the wiring is a high-frequency signal,due to a skin effect, a current density thereof is increased as thecurrent density comes closer to a surface of a conductor. Accordingly,the complexity of an outer shape of the first dummy conductor patterneffectively inhibits a flow of the eddy current in the pattern. As aresult, the eddy current decreases in magnitude, whereby the fluctuationof the circuit constant of the wiring can be suppressed to a smalllevel.

A semiconductor device according to another aspect of the presentinvention includes an interconnection conductor and a plurality of dummyconductor patterns arranged around the interconnection conductor, eachof the dummy conductor patterns has a polygonal shape with at least onedent which is provided at a part of a periphery of the polygonal shape.

In the semiconductor device, each of the dummy conductor patternsarranged around the interconnection conductor has a polygonal shape withat least one dent which is provided at a part of a periphery of thepolygonal shape. The presence of dent which is provided at a part of aperiphery of the polygonal shape leads to an increase in complexity ofthe shape of the dummy conductor pattern. In a case where a signalflowing through the interconnection conductor is a high-frequencysignal, due to the skin effect, the current density thereof is increasedas the current density comes closer to the surface of the conductor.Accordingly, the complexity of the outer shape of the first dummyconductor pattern effectively inhibits the flow of the eddy current inthe pattern. As a result, the eddy current decreases in magnitude,whereby the fluctuation of the circuit constant of the inductor can besuppressed to a small level.

According to the present invention, there can be achieved asemiconductor device capable of improving stability of transmissioncharacteristics of wiring.

BRIEF DESCRIPTION OF THE DRAWINGS

The above and other objects, advantages and features of the presentinvention will be more apparent from the following description ofcertain preferred embodiments taken in conjunction with the accompanyingdrawings, in which:

FIG. 1 is a plan view showing a semiconductor device according to anembodiment of the present invention;

FIG. 2 is a plan view showing a dummy conductor pattern formed near awiring;

FIG. 3 is a plan view for explaining a planar shape of the dummyconductor pattern of FIG. 2;

FIG. 4 is a plan view showing a dummy conductor pattern according to amodified example of the present invention;

FIG. 5 is a plan view showing a dummy conductor pattern according toanother modified example of the present invention;

FIG. 6 is a plan view for explaining a planar shape of the dummyconductor pattern of FIG. 5;

FIG. 7 is a plan view showing a dummy conductor pattern according tostill another modified example of the present invention;

FIG. 8 is a plan view showing an example of a shape of the dummyconductor pattern of FIG. 4 after being processed;

FIG. 9 is a plan view showing a semiconductor device of a related art;and

FIG. 10 is a plan view for explaining a problem of the semiconductordevice of the related art.

FIG. 11 is a plan view showing a semiconductor device according to amodified embodiment of the present invention.

FIG. 12 is a plan view showing a semiconductor device according toanother modified embodiment of the present invention.

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS

Hereinafter, exemplary embodiments of the present invention will bedescribed in detail with reference to the accompanying drawings. Notethat, in the description of the drawings, the same components aredenoted by the same reference symbols, and redundant explanationsthereof are omitted.

FIG. 1 is a plan view showing a semiconductor device according to anembodiment of the present invention. A semiconductor device 1 includes awiring 10 and dummy conductor patterns 20. The wiring 10 is a wiringthrough which a high-frequency current with a frequency of 5 GHz orhigher flows. In the embodiment of the present invention, the wiring 10functions as an inductor.

Near the wiring 10, a plurality of dummy conductor patterns 20 areformed. In this case, the dummy conductor pattern refers to a conductorpattern, presence or absence of which does not affect a circuitconfiguration of the semiconductor device 1. The dummy conductorpatterns 20 are arranged regularly, in particular, in a tetragonallattice shape. The dummy conductor patterns 20 are each made of the samematerial as that of the wiring 10. Examples of the material includecopper and aluminum. In a case where the wiring 10 and the dummyconductor patterns 20 are each made of copper, the wiring 10 and thedummy conductor patterns 20 are each formed by, for example, a damasceneprocess. Note that the wiring 10 and the dummy conductor patterns 20 maybe formed in the same layer or may be formed in different layers. In theformer case, it is preferable that the wiring 10 and the dummy conductorpatterns 20 be formed at the same time.

FIG. 2 is a plan view showing the dummy conductor pattern 20. A planarshape of the dummy conductor pattern 20 is equivalent to a shape with aninternal angle larger than 180°. As shown in FIG. 3, the planar shape ofthe dummy conductor pattern 20 is equivalent to a shape obtained byremoving, from a first rectangle R1, second rectangles R2 (portionsindicated by oblique lines). The first rectangle R1 can be defined as ashape with a smallest area among rectangles capable of including thedummy conductor pattern 20. The second rectangles R2 are positioned atcorner portions of the first rectangle R1, and each have an area smallerthan that of the first rectangle R1. In the embodiment of the presentinvention, all the four corner portions of the first rectangle R1 areremoved. As a result, the planar shape of the dummy conductor pattern 20becomes equivalent to a shape with four internal angles (portionssurrounded by circles shown in FIG. 2) of 270°. In other words, thedummy conductor pattern 20 has a cross shape in plan view. Note that asize of the dummy conductor pattern 20 (length of one side of the firstrectangle R1) is, for example, about 1 μm.

Returning to FIG. 1, the semiconductor device 1 further includes aplurality of dummy conductor patterns 30. The dummy conductor patterns30 are formed in a region near the wiring 10, that is, out of a regionin which the dummy conductor patterns 20 are formed. Accordingly, thedummy conductor patterns 30 are formed at positions far from the wiring10 as compared with the dummy conductor patterns 20. A planar shape ofeach of the dummy conductor patterns 30 is equivalent to a rectangle. Adata ratio in the region in which the dummy conductor patterns 20 areformed is smaller than a data ratio in the region in which the dummyconductor patterns 30 are formed. In this case, the data ratio refers toan area ratio of a conductor in a given region (in-plain region inparallel with substrate).

A factor in the difference in data ratio between the regions is that theplanar shape of each of the dummy conductor patterns 20 is equivalent tothe shape obtained by removing part of the rectangle as described above.The data ratio in the region in which the dummy conductor patterns 20are formed becomes smaller by an amount of the removed portions.However, even if the planar shape of each of the dummy conductorpatterns 20 is a rectangle, it is preferable that the above-mentionedmagnitude of correlation regarding the data ratio be established. Inother words, even when the dummy conductor patterns 20 and the dummyconductor patterns 30 each have a rectangular shape, it is preferablethat the dummy conductor patterns 20 and 30 be formed so that the dataratio of the former case becomes smaller than that of the latter case.

Effects of the embodiment of the present invention will be described. Inthe semiconductor device 1, the dummy conductor patterns 20 formed nearthe wiring 10 each have an internal angle larger than 180° in plan view.The presence of the internal angle leads to an increase in complexity ofthe shape of each of the dummy conductor patterns 20. In the case of thehigh-frequency current, due to the skin effect, the current density isincreased as the current density comes closer to the surface of theconductor. Accordingly, the complexity of the outer shape of the dummyconductor pattern 20 effectively inhibits the flow of the eddy current(indicated by arrows A3 shown in FIG. 2) in the pattern. Accordingly,the eddy current decreases in magnitude, whereby the fluctuation of thecircuit constant of the wiring 10 can be suppressed to a small level. Asa result, the semiconductor device 1 capable of improving the stabilityof the transmission characteristics of the wiring 10 is achieved.

According to the skin effect, a current density J in a conductor isrepresented by the following formula (1).

J(δ)=exp(−δ/d)   (1)

where δ represents a depth from the surface of the conductor, and drepresents a skin depth.

The skin depth d corresponds to the depth δ obtained when the currentdensity J becomes 1/e(about 0.37) times larger than current (=J(0) ) atthe surface, and is obtained by the following formula (2).

d={(2ρ)/(ωμ) }^(1/2)   (2)

where ρ represents an electric resistivity of the conductor, ωrepresents an angular frequency of the current, and μ represents anabsolute permeability of the conductor.

For example, in a case of copper (conductivity σ=5.80×10⁷ [S/m]), theskin depth d is 2.1 μm at a frequency of 1 GHz, 0.95 μm at a frequencyof 5 GHz, and is 0.66 μm at a frequency of 10 GHz. In a case of aluminum(conductivity σ=3.6×10⁷ [S/m]), the skin depth d is 2.65 μm at afrequency of 1 GHz, 1.2 μm at a frequency of 5 GHz, and is 0.839 μm at afrequency of 10 GHz.

Further, in the embodiment of the present invention, the dummy conductorpatterns 20 each have an internal angle of 270° in plan view. With theinternal angle of 270°, each of the dummy conductor patterns 20 can bedepicted using only two kinds of sides, that is, a side in parallel withan X-direction (horizontal direction of FIG. 2) and a side in parallelwith a Y-direction (vertical direction of FIG. 2). Accordingly, thedummy conductor patterns 20 can be easily formed, and eventually,production of the semiconductor device 1 can be facilitated.

The dummy conductor patterns 20 each have a shape obtained by removingall the four rectangular corners thereof. As a result, the dummyconductor patterns 20 each have four internal angles larger than 180°,where by an inhibition effect of the eddy current is further increased.In addition, the dummy conductor patterns 20 each have a cross shape inplan view. In view of an operation of the dummy conductor patterns 20facilitating the processing of the wiring 10, it is preferable that thedummy conductor patterns 20 each have a high degree of symmetricalproperty in shape as described above.

The data ratio in the region in which the dummy conductor patterns 20are formed is smaller than that in the region in which the dummyconductor patterns 30 are formed. The reduction in ratio of theconductors (dummy conductor patterns 20) formed near the wiring 10 alsocontributes to the suppression in eddy current generated by the magneticfield of the wiring 10.

The wiring 10 according to the embodiment of the present invention is aninductor. In this case, a magnetic field in a direction in which themagnetic field of the inductor is offset by the eddy current isgenerated, which results in reduction in strength of the magnetic fieldof the inductor. The reduction in strength of the magnetic field leadsto deterioration of a Q factor of the inductor. In this regard,according to the embodiment of the present invention, the eddy currentcan be suppressed as described above, whereby the deterioration of the Qfactor can be suppressed to a small level.

Although the present invention has been described above in connectionwith several preferred embodiments thereof, it is apparent that thepresent invention is not limited to the above embodiments, and may bemodified and changed without departing from the scope and spirit of theinvention. The planar shape of the dummy conductor pattern 20 is notlimited to the shapes illustrated in the above embodiment, but inaddition, various shapes can be used. For example, the planar shape ofthe dummy conductor pattern 20 may be an L-shape as shown in FIG. 4, ormaybe a U-shape as shown in FIG. 5. The planar shapes of the dummyconductor pattern 20 as shown in FIGS. 4 and 5 are equivalent to shapesobtained by removing, from a first rectangle, a second rectangle havingan area smaller than that of the first rectangle, in the same manner asin the dummy conductor pattern 20 shown in FIG. 2. In particular, in thedummy conductor pattern 20 shown in FIG. 5, one side of the secondrectangle R2 is in contact with one side of the first rectangle R1 asshown in FIG. 6.

Alternatively, the dummy conductor pattern 20 may have a planar shape asshown in FIG. 7. This shape is equivalent to a shape obtained byremoving a triangle from a rectangle. In addition, the dummy conductorpattern 20 may have at least one internal angle θ which satisfies180°<θ<360°, and the internal angle θ is not limited to 270°.

Note that the shapes shown in FIGS. 2, 4, 5, and 7 are ideal shapes in adesign phase of the dummy conductor pattern 20. In general, cornerportions in the design phase become rounded shapes after being actuallyprocessed. FIG. 8 shows an example of the shape of the dummy conductorpattern 20 of FIG. 4 obtained after being processed. In thespecification of the present invention, the shape as shown in FIG. 8 isalso included in the category of “shape with an internal angle largerthan 180°”. In the shape with no precise angle as in the example, aportion at which a tangential line L1 passing through an inside of theshape can be drawn (portion surrounded by a circle) is regarded as theinternal angle larger than 180°.

Further, in the embodiment of the present invention, the case where thewiring 10 is an inductor is illustrated, but a typical wiring may beused as the wiring 10.

Moreover, when the inductor comprising wiring 10 is enclosed with aguard ring wiring 40 as shown in FIG. 11, above-mentioned rectangulardummy conductor pattern 30 may be disposed outside of the guard ringwiring 40, and above-mentioned dummy conductor pattern 20 that considersthe decrease of eddy current may be disposed inside of the guard ringwiring 40. In FIG. 11, the inductor comprising wiring 10 is electricallyconnected with lower wiring through via 70. The guard ring wiring 40 isused to stabilize the potential of the semiconductor substrate (notshown in the figure) bellow the inductor, and the guard ring wiring 40is electrically connected with the semiconductor substrate through a via(not shown in the figure) and lower wiring (not shown in the figure).

In addition, when the inductor comprising wiring 10 is not enclosed witha guard ring wiring as shown in FIG. 12, borderline 60 is provided incase that a wiring 50 which is not connected with the inductorcomprising wiring 10 passes near the inductor comprising wiring 10, andabove-mentioned rectangular dummy conductor pattern 30 maybe disposed onwiring 50 sides from borderline 60, and above-mentioned dummy conductorpattern 20 may be disposed on wiring 10 sides from borderline 60. InFIG. 12, the inductor comprising wiring 10 is electrically connectedwith lower wiring through via 70. It is desirable to set distance B(referring to FIG. 12) from wiring 50 to borderline 60 equally asdistance C (Refer to FIG. 12) from the inductor comprising wiring 10 toborderline 60.

1. A semiconductor device, comprising: a wiring; and first dummyconductor patterns formed at a first region near the wiring, wherein aplanar shape of each of the first dummy conductor patterns is equivalentto a shape with an internal angle larger than 180°.
 2. The semiconductordevice according to claim 1, wherein a high frequency signal flowsthrough said wiring.
 3. The semiconductor device according to claim 2,wherein said high frequency signal has a frequency of 5 GHz or higher.4. The semiconductor device according to claim 1, further comprisingsecond dummy conductor patterns that are formed at a second region farfrom the wiring as compared with the first region.
 5. The semiconductordevice according to claim 4, wherein a data ratio in the first region issmaller than a data ratio in the second region.
 6. The semiconductordevice according to claim 1, wherein the wiring comprises an inductor.7. The semiconductor device according to claim 1, wherein the planarshape of each of the first dummy conductor patterns is equivalent to ashape with an internal angle of 270°.
 8. The semiconductor deviceaccording to claim 1, wherein the planar shape of each of the firstdummy conductor patterns is equivalent to a shape obtained by removing,from a first rectangle, a second rectangle having an area smaller thanthat of the first rectangle.
 9. The semiconductor device according toclaim 8, wherein the second rectangle is positioned at a corner of thefirst rectangle.
 10. The semiconductor device according to claim 9,wherein the planar shape of each of the first dummy conductor patternsis a cross shape.
 11. The semiconductor device according to claim 9,wherein the planar shape of each of the first dummy conductor patternsis an L-shape.
 12. The semiconductor device according to claim 8,wherein one side of the second rectangle is in contact with one side ofthe first rectangle.
 13. The semiconductor device according to claim 12,wherein the planar shape of each of the first dummy conductor patternsis a U-shape.
 14. A semiconductor device comprising an interconnectionconductor and a plurality of dummy conductor patterns arranged aroundthe interconnection conductor, each of the dummy conductor patterns hasa polygonal shape with at least one dent which is provided at a part ofa periphery of the polygonal shape.
 15. The semiconductor deviceaccording to claim 14, wherein the polygonal shape is one of a squareand a rectangle and the dent is one of a square and a rectangle.
 16. Thesemiconductor device according to claim 15, wherein four dents eachhaving one of a square and a rectangle are provided respectively at fourcorners of the polygonal shape having one of a square and a rectangle.17. The semiconductor device according to claim 14, wherein thepolygonal shape is one of a square and a rectangle and the dent is atriangle.
 18. The semiconductor device according to claim 14, whereinthe interconnection conductor is a first interconnection conductor andeach of the dummy conductor patterns is a first dummy conductor patter,the device further comprising a second interconnection conductor and aplurality of second dummy conductor patterns, each of the second dummyconductor patterns has a polygonal shape without a dent.
 19. Thesemiconductor device according to claim 18, the polygonal shape of eachof the first and second dummy conductor patterns is one of a square anda rectangle and the dent is one of a square and a rectangle.
 20. Thesemiconductor device according to claim 18, the polygonal shape of eachof the first and second dummy conductor patterns is one of a square anda rectangle and the dent is a triangle.